Wireless module Cinterion AC75/AC65

The wireless module Cinterion AC75/AC65

The wireless module Cinterion AC75/AC65

 

 

CINTERION AS75/AC65 - new on the M2M market!

 

Discontinued

Description:

The wireless module Cinterion AC75/AC65 EDGE standard for communication "machine-machine". Quad-enabled Java technology can be used in all wireless networks, GSM. AS75/AC65 specifically designed for the industries in which high demands to the level of applied technologies.

Support for Java allows developers to AC75/AC65 to take full advantage of hardware and software platform for fast and easy implementation of applications. Built-in module components - a powerful processor, flash memory is a large volume and so on - saves on material costs and quickly remove the finished product on the market. The new wireless module supports a wide range AC75/AC65 interfaces that can be integrated into a variety of popular applications.

The concept of relations "machine-machine" shows the huge market potential. Robust AC75/AC65 open new prospects for customers. AS75/AC65 specifically designed for the industries in which high demands to the level of applied technologies.

Key Features:

  • Quad-band GSM 850/900/1800 MHz;
  • GPRS Class 12 (multi-slot);
  • EDGE (E-GPRS) Class 12 (multi-slot): max. 236.8 kbit / s;
  • GPRS class 12: max. 86 kbit / s
  • Output Power RF:
    • Class 4 (2W) at EGSM850;
    • Class 4 (2W) at EGSM900;
    • Class 1 (1W) at GSM1800;
    • Class 1 (1W) at GSM1900;
  • Control via AT-commands (Hayes 3GPP TS 27.007, 27.005);
  • TCP / IP stack access via AT commands;
  • Supply voltage range: 3.2 ... 4.5 V;
  • Dimensions: 33,9 x 35 x 3,3 mm;
  • Weight: 7.5 g;
  • "Opaque" mode;
  • USSD support;
  • Fax: Group 3, Class 1;
    • Normal operation: -30 °C. .. +65 °C;
    • Restricted operation: -40 °C. .. +75 °C;
    • Turn off: +80 °C;
    • Storage temperature: -40°C ... +85°C;

Interfaces:

  • Audio: 2 x analogue, 1 x digital;
  • 2 x serial interface (ITU-T V.24 protocol);
  • Power supply;
  • USB 2.0 full speed;
  • SIM card interface 3 V, 1.8 V;
  • 2 x analog input (ADC);
  • 1 x analog out (PWM);

Additional features:

  • RIL driver for connecting to devices on bazeMicrosoft ® Windows Mobile ™;
  • "multiplex" driver for Microsoft ® Windows XP ™ and Microsoft ® Windows Vista ™;
  • IMEI client as an alternative;
  • 7E1 and 8E1 at serial interface;
  • RLS Monitor (detecting jamming);
  • Integrated Access Profile SIM-card;

Applications:

Module AC75/AC65can be used in cars under conditions of high temperatures and mechanical loads. Other potential sites of the module are lockers in which a malicious attempt at opening off an alarm or weather stations in remote areas, where the readings can be transmitted over the wireless modules.

The main wholesale customers devices are software companies of various electronic equipment, as well as system integrators who use the device functionally complete as the basis for the construction of various subsystems. End users of devices and services, provided they are large corporations, businesses, organizations, ministries, vertically integrated structures in business and government agencies.

The main sectors of the economy and spheres of activity, using the proposed device are: banking, telecommunications, energy, transport, logistics, mining and manufacturing, housing and utilities, city-forming enterprises, large networks of wholesalers and retailers, government agencies and law enforcement agencies. Most popular

solutions include payment systems and payment systems, accounting systems and energy consumption of materials, systems of tracking the movement of transport and cargo security systems and video surveillance systems, industrial automation systems, information systems, data collection and processing of telemetry data, game systems and remote control system.

Accessories:

Manufacturer
Part-number
PDF datasheet
Product description
Product image

Molex

(53748-0808)


Datasheet для board-to-board connector Molex

 

Board-to-Board Connector (80pin),

height 3mm, with no additional attachments on the board.

 

Connector module for Board-to-Board plug 80 PIN, height 3mm

Molex

(53916-0808)


Datasheet для board-to-board connector Molex

 

Board-to-board connector (80 pin),

height 4mm, no additional fixtures to the board.

 

Connector module for Board-to-Board plug 80 PIN, height 4mm
iRZ 001562

Antenna coupler

SMP-SMA

SMP-SMA

Molex

(91228-3001)

001229 Datasheet for the SIM card holder

Memory Card Connectors 2.54MM SIM 06P SMT W/EJECTOR

(SIM-card holder)

SIM Card Holder

Molex

(91236-0001)

000011 Datasheet Tray

Memory Card Connectors SIM CARD READER 6P

(Лоток для сим-карты)
Tray for sim-card

Package:

  • module CINTERION MC75i;
  • factory packaging;

Available documentation for the device:

datasheet_ac75_175008.pdf (669.34 KB) - brief specification;

ac65_ac75_hd_v02002n.pdf (2.62 MB) - Hardware Interface Description;

ac75_atc_v02002n.pdf (4.68 MB) - description of AT commands;


 
Wireless module Cinterion BGS3

Беспроводной модуль CINTERION BGS3

CINTERION BGS3 - это лучшее сочетание цены, качества и современных технологий!

Беспроводной модуль CINTERION BGS3
Доступен
Номер для заказа - 002347

Описание:

Ультракомпактный модуль с впечатляющими особенностями, такими, как: четырехдиапазонный ресивер, GPRS класса 10, TCP/IP-стек, RIL драйвер и совместимость со своими предшественниками.

Основные характеристики:

  • Четыре диапазона частот GSM (850/900/1800,1900) MHz;
  • GPRS класс 10;
  • CSD;
  • управление посредством AT-команд (Hayes 3GPP TS 27.007, TS 27.005;
  • TCP/IP стек, доступный через AT-команды;
  • Интернет-сервисы: TCP, UDP, HTTP, FTP, SMTP, POP3;
  • Hayes 3GPP TS 27.007 и 27.005;
  • Поддержка: SMS, RLS монитор, Fax Group3 class 1;
  • Габаритные размеры: 33.9 x 29.6 x 3.2 мм;
  • Вес: 5,5 гр.;

Интерфейсы:

  • RF U.FL-R-SMT 50 разъем;
  • cистемный разъем 50-пин;
  • аудио - 2 аналоговых;
  • cериальный интерфейс (ITU-Tv.24 протокол) 2;

Дополнительные возможности:

  • RIL драйвер для Microsoft ® Windows ™ Mobile 6,1;
  • Встроенная защита от перегрева;

Область применения:

BGS3 будет отличным решением там, где не нужна большая скорость, но необходима надежность. Данный модуль обладает оптимальным набором характеристик: расширенный температурный диапазон, малые габариты, четыре рабочих диапазона, полная экранированность и высокая стабильность — это лишь некоторые из них. Модуль разработан для широкого применения в M2M решениях для безопасности, торговли, счетчиков, дистанционного обслуживания и контроля. RIL-драйвер для устройств на основе Microsoft© Windows Mobile™ 6 упрощает разработку для смартфонов, КПК и промышленных карманных компьютеров.

Комплектация устройства:

  • модуль Cinterion BGS3;
  • заводская упаковка;

Доступная документация для устройства:

cinterion_BGS3_datasheet_evolution_LGA.pdf (800.26 KB) - краткое техническое описание для LGA модулей Cinterion;

*Дополнительную информацию, а также полную документацию по всем LGA модулям можно получить у наших менеджеров.

 
Wireless module Cinterion EES3

The wireless module Cinterion EES3

The wireless module Cinterion EES3

Available
Order Number - 002346

Description:

EES3 - GSM-module of the new series, made in the form factor for mounting LGA type, such as integrated TCP / IP stack, serial and USB ports, and RIL driver for Microsoft ® Windows ™ Mobile 6,1 devices. EES3 - one of the smallest EDGE modules in the world, having high speed data transmission and enhanced features. This module of the new line CINTERION, made ​​for mounting LGA type. The wireless module Cinterion EES3 has a modern element base, which made it even smaller size and provide exceptional reliability, allowing to guarantee the absence of any failures.

Key Features:

  • Quad band GSM (850/900/1800, 1900) MHz;
  • EDGE class 12 (up to 236.8 kbps);
  • GPRS Class 12;
  • CSD;
  • management via AT-commands (Hayes 3GPP TS 27.007, TS 27.005);
  • TCP / IP stack access via AT-commands;
  • Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3;
  • Hayes 3GPP TS 27.007 и 27.005;
  • Support: SMS, RLS Monitor, Fax Group3;
  • Dimensions: 33.9 x 29.6 x 3.2 mm;
  • Weight: 5.5 g.;

Interfaces:

  • RF U.FL-R-SMT connector 50;
  • System and network connector 50-pin;
  • Audio - 2 analog;
  • Serial interface (ITU-Tv.24 protocol);

Applications:

High speed data transfer technology, EDGE (up to 236 kbps), and reliability makes it almost indispensable for use in M2M solutions: traffic control systems and navigation Teleservice, security systems, remote monitoring, remote sensing, vending machines, etc.

Package:

  • module Cinterion EES3;
  • factory packaging;

Additional features:

  • RIL driver for Microsoft ® Windows ™ Mobile 6,1;
 
Wireless module Cinterion EGS3

Wireless module Cinterion EGS3

Wireless module Cinterion EGS3

 

 

 

 

 

Available
Order reference number- 002345

Description:

Cinterion EGS3 - GSM-module, made in the form factor for mounting LGA type, has more features such as integrated TCP/IP stack, serial and USB port interface SPI and I2C - with similar characteristics of the module provides easy EGS3 first-class GSM/GPRS communication.

 

Main parameters:

  • Quad-band frequency ranges GSM (850/900/ 1800/1900) MHz;
  • Control via AT commands (Hayes 3GPP TS 27.007 and 27.005);
  • Circuit Switched Data up to 14.4 kbps;
  • SMS, Fax Group 3, class 1;
  • SIM Application toolkit (release 99) letter class "b", "c" and "e";
  • TCP/IP stack access via AT commands and transparent TCP service;
  • Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3, Ping;
  • Supply voltage range: 3.2 … 4.5 V;
  • Operational temperature range: -40°C to +85°C, switch off: > +85°C
  • Dimensions: 33.9 x 29.6 x 3.2 mm;
  • Weight: 5.5 g;

Specification for voice:

  • Triple-rate codec for HR, FR, and EFR;
  • Adaptive multi-rate AMR;
  • Hands-free operation, Echo cancellation & Noise reduction;

Special features:

  • RLS Monitoring (Jamming detection);
  • Advanced Temperature Management;

Interfaces (LGA pads):

  • Antenna 50 Ω solder pad;
  • Audio: 2 x analog, 1 x digital;
  • Serial interfaces (ITU-T V.24 protocol)
  • SIM card interface 3 V, 1.8 V;

Application:

Evolution LGA solderable products include EES3, EGS5, EGS3 and BGS3 modules featuring efficient and reliable LGA surface mounting technology along with optimized size and performance. Cinterion added two new modules to the second generation of its successful Evolution Platform as well as expanded features such as tunneling mode and a location API for the embedded Java variant. The new EGS5-X offers an extended memory (1.7 MB RAM, 8 MB Flash File System) and also enables integrated Firmware Over The Air Update (FOTA) to protect customer investment. BGS3-ATEX adheres to the latest ATEX 95 standard and is designed for safe use in potentially hazardous environments where there is risk of an explosion such as in gas meters.

Set:

  • CINTERION EGS3 wireless module;
  • factory packaging;
 
Wireless module Cinterion EGS5

Wireless module Cinterion EGS5

The wireless module Cinterion EGS5

 

 

 

 

Available
Order number - 002344

Description:

GSM module Cinterion EGS5 made on the basis of one of the most advanced ARM processor 9, which can handle data at high speed. In addition, it provides support for encryption for applications that require secure data transmission, for example, HTTP, and PKI. The main difference from the other modules in this series - support download applications written in Java ™.

Key Features:

  • Frequency band GSM (850/900/1800/1900) MHz;
  • Data GPRS Class 12 (up to 86 kbps);
  • CSD (up to 14.4 kbps);
  • Internet services: TCP, UDP, HTTP, FTP, SMTP, POP3;
  • Control via AT commands;
  • Hayes 3GPP TS 27.007 и 27.005;
  • TCP/IP stack, managed by AT-commands;
  • Support for SMS;
  • Fax Group3, class 1;
  • RLS Monitor;
  • Interfaces RF U.FL-R-SMT connector 50;
  • system connector 50-pin;
  • Audio - 2 analog;
  • Serial interface (ITU-Tv.24 protocol);
  • USB 2.0;
  • GPIO;
  • Power supply: 3.2 ... 4,5 V;
  • Operating temperature range: -40°C to +85 °C;
  • Auto Power Off: above +85 ° C;
  • Dimensions: 33.9 x 29.6 x 3.2 mm;
  • Weight: 5.5 g;

Applications:

GSM module Cinterion EGS5 refers to the current generation of wireless modules for business applications such as commercial machines, point of sale, remote measurement, the security sector, etc.

Package:

  • module CINTERION EGS5;
  • factory packaging;
 
Wireless module Cinterion HC25

The wireless module Cinterion HC25

The wireless module Cinterion HC25

 

 

CINTERION HC25 - new on the market M2M!

 

 

Available
Order Number - 001573

Description:

Cinterion HC25 perfectly compatible with the networks GSM and 3G. Created on the basis Cinterion HC25 devices and applications can take advantage of opportunities and technology HSDPA*.Cinterion HC25 developed for Europe, Middle East, Africa and Asia. With full compatibility (FTA) solutions based on this module can be developed in a short time and at low cost. Download speed - 3.6 Mb / s at 2100 MHz. Comfortable, secure fit-designed interface - all to develop high-speed data applications in a short time and at minimal cost.

Applications based on Windows©and can use NDIS-driver interface and USB 2.0 full speed.

*HSDPA(English High-SpeedDownlinkPacketAccess - high-speed packet data) - the standard of mobile communication is seen by experts as one of the stages of transition to technology mobile fourth generation (4G). The maximum theoretical data transfer rate standard is 14.4 Mbit / sec., Achievable in the existing networks - about 4 Mbit / sec.

Specifications:

  • HSDPA up to 3.6 Mbps;
  • single-band UMTS/HSDPA (WCDMA/FDD) frequency of 2100 MHz;
  • GSM frequency band 900/1800 MHz;
  • EDGE multislot class 10;
  • GPRS multislot class 10;
  • UMTS/HSDPA 3GPP Release 5;
  • GSM 3GPP release 99;
  • Output Power:
    • Class 4 (2 W) for GSM900;
    • Class 3 (0.25 W) for UMTS;
    • Class E2 (0.5 W) for EDGE900;
    • Class E2 (0.4 W) for EDGE1800;
    • Class 1 (1 W) for GSM1800;
  • AT command support 3GPP TS 27.007 and 27.005;
  • Supply voltage: 3.2 ... 4.2 V;
  • Automatic shut-off: 4.3 V;
  • Power consumption:
    • Standby 50 mA;
    • in operation: 970mA (HSDPA data transfer);
  • Temperature Range:
    • Operating Range: -20°C to +65 °C;
    • Limited range: -30°C to +75°C;
    • Automatic shut-off: +85°C;
    • Storage: -40°C to +85°C;
  • Dimensions: 34 x 50 x 4.5 mm;
  • Weight: about 10g;

Interfaces:

  • Antenna connector U.FL-R-SMT 50 and pad;
  • System 50-pin connector;
  • Audio: 1 x analogue;
  • High-Speed ​​USB 2.0;
  • UICC / SIM interface 3 V, 1.8 V;

Data Transfer:

  • HSDPA:
    • max. 3.6 Mbps (receiving);
    • max. 384 kbps (transmission);
  • UMTS:
    • max. 384 kbps (receive);
    • max. 384 kbps (transmission);
  • EDGE class 10:
    • max. 236,8 kbps (receive);
    • max. 118 kbps (transmission);
  • GPRS class 10:
    • max. 85.6 kbps (receive);
    • max. 42.8 kbps (transmission);
  • GSM data rate 14.4 kbps, V.110;
  • UMTS data rate 57.6 kbps V.120.;

Applications:

The main wholesale customers devices are software companies of various electronic equipment, as well as system integrators who use the device functionally complete as the basis for the construction of various subsystems. End users of devices and services, provided they are large corporations, businesses, organizations, ministries, vertically integrated structures in business and government agencies.

The main sectors of the economy and spheres of activity, using the proposed device are: banking, telecommunications, energy, transport, logistics, mining and manufacturing, housing and utilities, city-forming enterprises, large networks of wholesalers and retailers, government agencies and law enforcement agencies.

The most popular solutions are often the payment system and payment system, accounting of materials and energy consumption, tracking the movement of transport and cargo security systems and video surveillance systems, industrial automation systems, information systems, data collection and processing of telemetry data, playgrounds and systems remote control.

Accessories:

Manufacturer
Part number
PDF datasheet
Product description
Product image

Hirose

(DF12E(3.0)-50DP-0.5V(81))


Datasheet для board-to-board connector Hirose

 

Board-to-Board Connector (50pin),

Height 3mm

Board-to-Board plug 50 PIN, height 3mm

Hirose

(DF12E(5.0)-50DP-0.5V(81))


Datasheet для board-to-board connector Hirose

 

Board-to-board connector (50 pin),

Height 5mm.

 

Board-to-Board plug 50 PIN module connector, height 5mm

Hirose

(CL331-0451-2)


Datasheet для antenna connector

Antenna connector,

U.FL-LP-040

(коннектор для кабеля сечением 0.81mm)

Кабельная сборка UFL-m/FME-m

Hirose

(CL331-0452-5)

 

Datasheet для antenna connector

Antenna connector,

U.FL-LP-066

(Connector for cable 1.13mm и 1.32mm)

UFL-m/SMA-f

Molex

(91228-3001)

001229 Datasheet for SIM-card holder

Memory Card Connectors 2.54MM SIM 06P SMT W/EJECTOR

SIM cardholder

SIM Card Holder

Molex

(91236-0001)

000011 Datasheet for socket

Memory Card Connectors SIM CARD READER 6P

(Tray for the SIM card)
SIM-card holder

Packaging arrangement:

  • CINTERION HC25 module;
  • Factory packing.

Available product documentation:

hc25_175009.pdf (694.00 KB)- brief specification;

hc25_hd_v01000.pdf (1.19 MB) - Hardware Interface Description;

hc25_atc_v01000.pdf (2.10 MB) - description of AT commands;

 
Wireless module Cinterion MC55i

The wireless module Cinterion MC55i

The wireless module Cinterion MC55i

 

 

CINTERION MC55i - new on the market M2M!

 

Available
Order number - 000198

Description:

Is a copy of the moduleCinterion MC52i - the only difference is the ability to work in the Asian region, has a similar form factor and pin-to-pin compatibility.

Key Features:

  • frequency bands GSM 850/900/1800/1900 MHz;
  • GPRS class 10 (multislot);
  • management via AT-commands (Hayes 3GPP TS 27.007, TS 27.005);
  • TCP / IP stack access via AT-commands;
  • Internet services: TCP Server / Client, UDP, HTTP, FTP, SMTP, POP3;
  • supply voltage range: 3.3 ... 4.8 V;
  • Operating temperature range: -40°C ... +85°C;
  • size: 35 x 32.5 x 2.95 mm (incl. connector interboard: 3.1 mm);
  • Weight: 5.5 g;

Additional features:

  • RIL driver for connecting to devices based on Microsoft ® Windows Mobile ™;
  • "Multiplex" driver for Microsoft ® Windows XP ™ and Microsoft ® Windows Vista ™;
  • IMEI client as an alternative;

Interfaces:

  • antenna connector U.FL-R-SMT 50;
  • platform for soldering antenna
  • 50-pin connector interboard;
  • power supply;
  • Audio: 2 x analogue, 1 x digital;
  • SIM-card interface 1.8 ... 3 V;
  • 2 x serial interface (ITU-T V.24 protocol);
  • charger;

Applications:

The ideal candidate for integration into M2M solutions: traffic management and navigation; teleservice, security, remote monitoring, remote sensing, vending machines, etc.

Accessories:

Manufacturer
Part number
PDF datasheet
Product description
Product image

Hirose

(DF12E(3.0)-50DP-0.5V(81))


Datasheet для board-to-board connector Hirose

 

Board-to-Board plug 50 PIN, height 3mm

Board-to-Board plug 50 PIN, height 3mm

Hirose

(DF12E(5.0)-50DP-0.5V(81))


Datasheet для board-to-board connector Hirose

Board-to-Board plug 50 PIN, height 5mm

 

Board-to-Board plug 50 PIN, height 5mm

Hirose

(CL331-0451-2/td)


Datasheet for antenna connector

Antenna connector,

U.FL-LP-040

(Connector for cable 0.81mm)

UFL-m/FME-m

Hirose

(CL331-0452-5)

 

Datasheet for antenna connector

Antenna connector,

U.FL-LP-066

(Connector for cable 1.13mm and 1.32mm)

UFL-m/SMA-f

Molex

(91228-3001)

001229 Datasheet for the SIM card holder

Memory Card Connectors 2.54MM SIM 06P SMT W/EJECTOR

(держатель сим-карты)

SIM Card Holder

Molex

(91236-0001)

000011 Datasheet for tray

Memory Card Connectors SIM CARD READER 6P

(Лоток для сим-карты)
Tray for sim-card

Package:

  • module CINTERION MC55i;
  • factory packaging;

Available documentation for the device:

Cinterion_MC52i_datasheet.pdf (1.21 MB) - A brief technical description;

Mc52i_hid.pdf (2.23 MB) - Hardware Interface Description;

MC52i AT Command Set.rar (2.08 MB) - description of AT commands;


 
Wireless module Cinterion MC75i

The wireless module Cinterion MC75i

The wireless module Cinterion MC75i

 

 

CINTERION MS75i - new on the market M2M!

 

Available
Order number - 000071

Description:

Module Cinterion MC75i - reliable quad-cell module with support for high speed data EDGE, it's possible to high-speed and reliable transmission of multimedia information - streaming audio and video, digital photos, instant messaging. Transmission speed EDGE is three times the speed of GPRS-channel and can reach 250 kbit / sec. An alternative to the module supports EDGE support GPRS Multislot Class 12. The module is equipped with two serial interfaces, support for USB 2.0. An additional advantage - built-in SD / MMC.

Key Features:

  • Quad-band GSM 850/900/1800/1900 MHz;
  • GPRS class 12 (multislot);
  • EDGE (E-GPRS) Class 12 (multislot): max. 236.8 kbps;
  • GPRS class 12: max. 86 kbit/s;
  • Output Power RF:
    • Class 4 (2W) at EGSM850;
    • Class 4 (2W) at EGSM900;
    • Class 1 (1W) at GSM1800;
    • Class 1 (1W) at GSM1900;
  • Control via AT-commands (Hayes 3GPP TS 27.007, 27.005);
  • TCP / IP stack access via AT commands;
  • Supply voltage range: 3.2 ... 4.5 V;
  • Dimensions: 33,9 x 35 x 3,3 mm;
  • Weight: 7.5 g;
  • "Opaque" mode
  • USSD support;
  • Fax: Group 3, Class 1;
    • The normal mode of operation: -30°C...+65°C;
    • Limited operation: -40°C...+75°C;
    • Disconnection: +80°C;
    • Storage temperature: -40°C ... +85°C;

Interfaces:

  • Audio: 2 x analogue, 1 x digital;
  • 2 x serial interface (ITU-T V.24 protocol);
  • Power supply;
  • USB 2.0 full speed;
  • SIM card interface 3 V, 1.8 V;
  • 2 x analog input (ADC);
  • 1 x analog out (PWM);

Additional features:

  • RIL driver for connecting to devices based on Microsoft ® Windows Mobile ™;
  • "multiplex" driver for Microsoft ® Windows XP ™ and Microsoft ® Windows Vista ™;
  • IMEI client as an alternative;
  • 7E1 and 8E1 at serial interface;
  • RLS Monitor (detecting jamming);
  • Integrated Access Profile SIM-card;

Applications:

The main wholesale customers devices are software companies of various electronic equipment, as well as system integrators who use the device functionally complete as the basis for the construction of various subsystems. End users of devices and services, provided they are large corporations, businesses, organizations, ministries, vertically integrated structures in business and government agencies.

The main sectors of the economy and spheres of activity, using the proposed device are: banking, telecommunications, energy, transport, logistics, mining and manufacturing, housing and utilities, city-forming enterprises, large networks of wholesalers and retailers, government agencies and law enforcement agencies.

The most popular solutions are often the payment system and payment system, accounting of materials and energy consumption, tracking the movement of transport and cargo security systems and video surveillance systems, industrial automation systems, information systems, data collection and processing of telemetry data, playgrounds and systems remote control.

Accessories:

Manufacturer
Part number
PDF datasheet
Product description
Product image

Molex

(53748-0808)


Datasheet для board-to-board connector Molex

 

Board-to-Board Connector (80pin),height 3 mm

 

Board-to-Board plug 80 PIN, height 3mm

Molex

(53916-0808)


Datasheet для board-to-board connector Molex

 

Board-to-board connector (80 pin),height 4mm

 

Board-to-Board plug 80 PIN, height 4mm

Hirose

(CL331-0451-2)


Datasheet for antenna connector

Antenna connector,

U.FL-LP-040

(Connector for cable 0.81mm)

UFL-m/FME-m

Hirose

(CL331-0452-5)

 

Datasheet for antenna connector

Antenna connector,

U.FL-LP-066

(Connector for cable 1.13mm and 1.32mm)

UFL-m/SMA-f

Molex

(91228-3001)

001229 Datasheet for the SIM card holder

Memory Card Connectors 2.54MM SIM 06P SMT W/EJECTOR

SIM Card Holder

Molex

(91236-0001)

000011 Datasheet for tray

Memory Card Connectors SIM CARD READER 6P

(Tray for sim-card)
Tray for sim-card

Set:

  • CINTERION MC75i;
  • Factory packaging;

Available product documentation:

75itc65itc63i_175016.pdf (721.05 KB)- A brief technical description;

mc75i_hd_v01100a.pdf (2.30 MB) - Hardware Interface Description;

mc75i_atc_v01100.pdf (6.05 MB) - description of AT commands;

cinterion-tc65-tc75.rar(2 KB)-Driver for USB-port;


 
Wireless module Cinterion TC65i

The wireless module Cinterion TC65i

The wireless module Cinterion TC65i

 

 

CINTERION TS65i - new on the market M2M!

 

Available
Order number - 000129

Description:

Cinterion TC65i Module with support for Java, and built-in TCP/IP-stack. The first of its kind product that provides hardware and software platform for creating your own M2M applications. In addition, TC65 Module provides voice quad-band GSM and data transmission via GPRS Class 12.High-speed data processing provides the processor ARM7, internal memory of 1.7 MB. With the support of a wide variety of interfaces, the module can be used to solve many problems of the scope of applications M2M: remote measurement systems, security systems, retail and banking machines, cash registers, etc.

Key Features:

  • Quad-band GSM 850/900/1800/1900 MHz;
  • GSM release 99;
  • GPRS class 12 (multislot);
  • Output Power RF:
    • Class 4 (2W) for EGSM 850 and 900;
    • Class 1 (1W) for GSM 1800 and 1900;
  • AT-commands Hayes GSM 07.05 and GSM 07.07;
  • Supply voltage range: 8V + ... + 30 V (DC);
  • Power-saving;
  • Ambient temperature range:- 30 – +65 °C;
  • Storage temperature range: -40°C…+85°C;
  • Fax: Group 1 class 3;
  • Internet services: TCP Server / Client, UDP, HTTP, FTP, SMTP, POP3;

Interfaces:

  • 24-pin Micro-N-Lok:
    • I2C bus and SPI;
    • 2 x analog in (ADC);
    • 10GPIO;
    • VDD (2.9 V);
  • Antenna connector SMA;
  • 9-pin sub-D for serial interfaces with the protocol of ITU-T V.24;
  • micro telephone pair of audio frequency;

Applications:

TC65 Module supporting Java-technology makes it possible not only to reduce application development time, but the equipment costs, since the module does not require an additional controller, memory, and TCP / IP-stack.

The main customers of devices are software companies of different electronic equipment, as well as system integrators who use a functionally complete unit as the basis for the construction of various subsystems. End users of devices and services, provided they are large corporations, businesses, organizations, ministries, vertically integrated structures in business and government agencies.

The main sectors of the economy and spheres of activity, using the proposed device are: banking, telecommunications, energy, transport, logistics, mining and manufacturing, housing and utilities, city-forming enterprises, large networks of wholesalers and retailers, government agencies and law enforcement agencies.

The most popular solutions are often billing systems and metering of materials and energy systems, payment systems, tracking the movement of transport and cargo security systems and video surveillance systems, industrial automation systems, information systems, data collection and processing of telemetry data, playgrounds and systems remote control.

Accessories:

Manufacturer
Part number
PDF datasheet
Product description
Product image

Molex

(53748-0808)


Datasheet для board-to-board connector Molex

 

Board-to-Board Connector (80pin), height 3mm

 

Board-to-Board plug 80 PIN, height 3mm

Molex

(53916-0808)


Datasheet for board-to-board connector Molex

 

Board-to-board connector (80 pin),height 4mm

 

Board-to-Board plug 80 PIN, height 4mm

Hirose

(CL331-0451-2)


Datasheet for antenna connector

Antenna connector,

U.FL-LP-040

(коннектор для кабеля сечением 0.81mm)

UFL-m/FME-m

Hirose

(CL331-0452-5)

 

Datasheet for antenna connector

Antenna connector,

U.FL-LP-066

(коннектор для кабеля сечением 1.13mm и 1.32mm)

UFL-m/SMA-f

Molex

(91228-3001)


Datasheet for the SIM card holder

Memory Card Connectors 2.54MM SIM 06P SMT W/EJECTOR

(держатель сим-карты)

SIM Card Holder

Molex

(91236-0001)


Datasheet for tray

Memory Card Connectors SIM CARD READER 6P

(Лоток для сим-карты)
Tray for sim-card

Package:

  • CINTERION TC65i module;
  • factory packaging;

Available documentation for the device:

CinterionTC65_win_multiplexer_driver_v02.1.zip (600.87 KB) - archive with the driver and installation guide for TC65T for OS MS Windows XP;

datasheet_scalableplatformmc75itc65itc63i_175016.pdf (721.05 KB) - Brief specification;

tc65i_hd_v01100b.pdf (2.33 MB) - Hardware Interface Description;

tc65i_atc_v01100.pdf (4.50 MB) - description of AT commands;

cinterion-tc65-tc75.rar(2 KB)-Driver for USB-port;

 
Wireless module Cinterion XT75/XT65

The wireless module Cinterion XT75/XT65

The wireless module Cinterion XT75/XT65

 

 

CINTERION XT75/XT65 - new on the market M2M!

 

Available
Order number - 001556

Description:

The wireless module Cinterion XT75/XT65 -first quad module with support for GPS, which provides both high sensitivity and accuracy of the GPS-signal reception and high-speed data packet EDGE and GPRS. Positioning accuracy is achieved through an integrated 16-channel GPS receiver with A-GPS support and DGPS. Full mechanical and logical integration of GPS-technology in the GSM-module minimizes the cost of purchasing components, and support for open Java platform and the richness of standardized interfaces ensure minimum costs for industrial development.The compact support of the XT75 and RIL-driver MS Mobile 5.0, the new module will be applicable to mobile devices. The junior version of the module XT65 XT75 has all the advantages except to support EDGE-standard.

Modules XT75 XT65 and designed for tasks such as managing a fleet of vehicles, location of moving objects, navigation, implementation of emergency calls, as well as to provide services based on location. With these modules, users can set the exact location of the interest of his people, vehicles, goods in transit or end devices. Information about the location of an object can send and receive well over the mobile network. The driver of the car, for example, can download a navigation system, information about the location of the nearest restaurant, or send an emergency SMS-message with information about his where abouts.

Rapid determination of object location by satellite is performed on the 16 parallel channels, using the data of A-GPS. Integrated communications protocol TCP / IP (TCP / IP stack) converts the data in A-GPS data packet and then passes them on the technology EDGE (XT75) or GPRS (XT75 and XT65) in the mobile network. Both modules can send and receive data at frequencies of 850, 900, 1800 and 1900 MHz. Data transfer rate of the module XT75 is almost three times the speed of information transmission network ISDN. The modules have the dimensions 54 mm x 39 mm x 3,5 mm and in order to reduce power consumption using different power saving modes provided by GSM and GPS. Built-in driver RIL provides easy connection to endpoints that are running the operating system Microsoft ® Windows Mobile ™.

Key Features:

  • Quad-band GSM 850/900/1800 MHz;
  • GPRS class 12 (multislot);
  • EDGE (E-GPRS) class 12 (multislot): max. 236.8 kbit/s;
  • GPRS class 12: max. 86 kbit/s;
  • Output Power RF:
    • Class 4 (2W) at EGSM850;
    • Class 4 (2W) at EGSM900;
    • Class 1 (1W) at GSM1800;
    • Class 1 (1W) at GSM1900;
  • Control via AT-commands (Hayes 3GPP TS 27.007, 27.005);
  • TCP / IP stack access via AT commands;
  • Supply voltage range: 3.2 ... 4.5 V;
  • Dimensions: 33,9 x 35 x 3,3 mm;
  • Weight: 7.5 g;
  • "Opaque" mode;
  • USSD support;
  • Fax: Group 3, Class 1;
    • The normal mode of operation: -30°C...+65°C;
    • Restricted operation: -40°C...+75°C;
    • Switchoff: +80°C;
    • Storage temperature: -40°C ... +85°C;

Interfaces:

  • Audio: 2 x analogue, 1 x digital;
  • 2 x serial interface (ITU-T V.24 protocol);
  • Power supply;
  • USB 2.0 full speed;
  • SIM card interface 3 V, 1.8 V;
  • 2 x analog input (ADC);
  • 1 x analog out (PWM);

Additional features:

  • RIL driver for connecting to devices based on Microsoft ® Windows Mobile ™;
  • "multiplex" driver for Microsoft ® Windows XP ™ and Microsoft ® Windows Vista ™;
  • IMEI client as an alternative;
  • 7E1 and 8E1 at serial interface;
  • RLS Monitor (detecting jamming);
  • Integrated Access Profile SIM-card;

Applications:

The main wholesale customers devices are software companies of various electronic equipment, as well as system integrators who use the device functionally complete as the basis for the construction of various subsystems.End users of devices and services, provided they are large corporations, businesses, organizations, ministries, vertically integrated structures in business and government agencies.

The main sectors of the economy and spheres of activity, using the proposed device are: banking, telecommunications, energy, transport, logistics, mining and manufacturing, housing and utilities, city-forming enterprises, large networks of wholesalers and retailers, government agencies and law enforcement agencies.

The most popular solutions are often the payment system and payment system, accounting of materials and energy consumption, tracking the movement of transport and cargo security systems and video surveillance systems, industrial automation systems, information systems, data collection and processing of telemetry data, playgrounds and systems remote control.

Accessories:

Manufacturer
Part number
PDF datasheet
Product description
Product image

Molex

(53748-0808)


Datasheet for board-to-board connector Molex

 

Board-to-Board Connector (80pin),height 3mm

 

Board-to-Board plug 50 PIN, height 3mm

Molex

(53916-0808)


Datasheet for board-to-board connector Molex

 

Board-to-board connector (80 pin),height 5mm

 

Board-to-Board plug 50 PIN, height 5mm

Hirose

(CL331-0451-2)


Datasheet for antenna connector

Antenna connector,

U.FL-LP-040

(Connector for cable 0.81mm)

UFL-m/FME-m

Hirose

(CL331-0452-5)

 

Datasheet for antenna connector

Antenna connector,

U.FL-LP-066

(Connector for cable 1.13mm and 1.32mm)

UFL-m/SMA-f

Molex

(91228-3001)

001229 Datasheet for the SIM card holder

Memory Card Connectors 2.54MM SIM 06P SMT W/EJECTOR

(держатель сим-карты)

SIM Card Holder

Molex

(91236-0001)

000011 Datasheet for tray

Memory Card Connectors SIM CARD READER 6P

(Лоток для сим-карты)
Tray for sim-card

Complete unit:

  • модуль CINTERION XT75/XT65;
  • factory packaging;

Available documentation for the device:

datasheet_xt75_175004.pdf (601.11 KB) - brief specification;

xt65_xt75_hd_v02002.pdf (2.69 MB) - Hardware Interface Description;

xt75_atc_v02002.pdf (4.71 MB) - description of AT commands;

datasheet_xt65_175022.pdf (599.75 KB) - Brief specification;

xt65_atc_v02002.pdf (4.70 MB) - description of AT commands;